Temconex® technology describes a continuous powder extrusion process with precise die temperature control for the production of semi-finished products.
This process represents a further development of the Conform™ process. Using the Temconex® process, powders, chips and granules can be processed into wires, profiles, rods, and tubes with a density of 100%, excellent mechanical properties and very good surface quality. Prior to powder extrusion, the feedstock can be prepared in a roller press.
This granulation process enables binder-free dry agglomeration of metallic powders or powder mixtures, e.g. for fiber- or particle-reinforced MMCs. The process is characterized by high material and energy efficiency, a short process chain and a high degree of automation.
Alloys based on aluminum, copper, titanium and silver, as well as multilayer composite materials (MMCs) are processed. Various feed grades, from powder to granules, are used, including recycled chips with the corresponding pre-processing. Binder-free granulation improves flowability and prevents segregation of different powder materials.
Materials characterization encompasses chemical analyses (e.g., spark spectrometry, GDOES, XRF, EDX, N/O/C/S analyzer, microprobe) to determine alloy composition, impurities and elemental distribution; physical analyses (laser flash apparatus, dilatometer, buoyancy weighing) to determine thermal conductivity, thermal expansion and density; optical analyses using light and scanning electron microscopy, including particle size analysis.
This is complemented by the determination of mechanical properties, in which static, cyclic, and dynamic properties are tested under various stress states and temperatures. Deformations are recorded using optical measuring systems and hardness and creep properties are determined using hardness testers and creep testing equipment. The Young’s modulus is precisely determined using RFDA (resonance frequency damping analysis).